SMT- Surface Mount Assembly

Machine and hand placement capabilities, which include: - Placing packages as small as 0402 .- BGA, SOIC, PLCC, QFP are all standard packages for us .- We can also handle ultra fine pitch to 0.015”.- X-ray and AOI equipment. - Prototype through pre-production and small volume to high volume capacity.   Our expertise with mixed technology combined with SMT, through-hole assembly, wire harnessing, and electro-mechanical assembly make Caladena the optimum choice for all your assembly requirements! Contact us and experience the difference and quality of Caladena!